Dental adhesives can be broadly broken up into four categories: universal, total-etch, self-etch and selective-etch. These terms refer to the technique used with the dental adhesive, which also are referred to as bonding agents. Universal dental adhesives are formulated to work with all three etching techniques. Dental adhesives may be self-cure, light-cure or dual cure, curing times vary between products but are usually under 30 seconds. Solvents differ based on dental adhesive formulas but are usually water, ethanol or acetone. When choosing a dental adhesive some factors to take into account are incidence of post-operative sensitivity, bond strength, ease of use and workability as well as compatibility with resin cement systems. Also be sure to select the best dental adhesive for the procedure, for example, an enamel procedure is best suited by a total-etch adhesion, whereas a largely dentin preparation may be better serviced by a self-etching adhesion. Research the best dental adhesive for your specific needs.
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| Company | DenMat | DenMat | DenMat | DenMat | DenMat |
| Item | Tenure4G Dual Solvent Bonding Agent | BondLink | Tenure Multi-Purpose Bonding System | Tenure Quick w/ Fl Adhesive | Tenure Uni-Bond |
| Price | Inquire | Inquire | Inquire | Inquire | Inquire |
| Description | The next generation of DenMat’s Tenure MPB bonding system, Tenure4G is a 4th generation, self-cure adhesive system capable of bonding any resin | BondLink - the coupling agent that makes single-bottle adhesives compatible with self-cure and dual-cure composites. BondLink will make the following | For over 20 years, the Tenure Multi-Purpose Bonding System has demonstrated a proven clinical record of successful restorations with high bond | Tenure Quik's formulation provides for a surface-penetrating, low viscosity bonding agent. Once applied to etched enamel and dentin, you can be | Tenure Uni-Bond self-etching bonding system simplifies all direct bonding applications with anterior and posterior composites. It is ideal when |
| Tensile Bond Strength | Not Available | Not Available | 20 Mpa | 31 to 34 MPa | Unetched Enamel : 3502 psi ± 279 Unetched Dentin : 3650psi ± 277 Etched Enamel : 3341psi ± 542 Etched Dentin : 3008psi ± 606 |
| Curing Time | 10 to 15 seconds, allow to fully evaporate | Not Available | 10 to 15 seconds - Allow to fully evaporate | 5 seconds (Sapphire Plasma Arc Curing Light); 10 seconds with Phase II High-Speed Halogen Lights; 30 seconds with conventional curing lights | 5 seconds with Sapphire Plasma Arc Curing Light
10 seconds with Phase II High-Speed Halogen Lights
30 seconds with conventional curing lights |
| pH | 5.8 to 6.2 (Tenure4G A); N/A (Tenure4G B) | Not Available | Not Available | Not Available | Not Available |
| Solvent | Ethanol and Acetone | Acetone | Not Available | Not Available | Acetone |
| Filled Resin | Tenure4G contains a 3mL syringe of Tenure S Filled Enhancer, but Tenure4G A, Tenure4G B, and Tenure S Bond Enhancer are unfilled. | No | Tenure MPB contains a 3mL syringe of Tenure S Filled Enhancer, but Tenure A, Tenure B, and Tenure S Bond Enhancer are unfilled. | Not Available | Not Available |
| Number of Components | 9 | 5 | Not Available | 8 | Not Available |
| Self Etching | No | Not Available | No | Not Available | Yes |
| Fl Release | No | No | No | Yes | No |
| Light or Self Cured | Self Cure | Self Cure | Self Cure | Light Cure | Light Cure |
| Mixing Required | Yes | Not Available | Yes | No | Yes |
| Get Info | Not Available | Not Available | Not Available | Not Available | Not Available |